Substrate film and method of manufacturing the same

摘要

Provided are a substrate film and a method of manufacturing the substrate film. The substrate film may have excellent thermal resistance and dimensional stability, has excellent stress relaxation to prevent damage of a wafer caused by remaining stress, inhibits damage to or flying-off of the wafer caused by application of a non-uniform pressure during the processing of the wafer, and has excellent cuttability. Accordingly, the substrate film of the present invention can be effectively used as a processing sheet in a process of processing various kinds of wafers including dicing, back-grinding or picking-up.

主权项

1. A substrate film, which has a toughness of 10 Kg·mm to 250 Kg·mm at 23° C. comprising a cured product of a solventless composition, wherein the solventless composition comprises:
a (meth)acrylic polymer component comprising a (meth)acrylic acid ester-based monomer as a polymerization unit, and having a photoreactive group on a side chain or terminal end thereof; and a component of a monomer having a high glass transition temperature, wherein the cured product has a glass transition temperature of −20° C. (250K) or more, and wherein the substrate film has a modulus of 10 MPa to 200 MPa.