发明名称 |
ELECTRONIC DEVICE WITH HEAT SPREADING FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide improved arrangements for managing heat in electronic devices.SOLUTION: An electronic device may have a housing in which components that produce heat are mounted. The heat producing components may be light-emitting diodes mounted on a flexible printed circuit in a display backlight, may be integrated circuits, or may be other devices that generate heat during operation. A heat spreading layer such as a layer of graphite may be attached to the backlight unit or other structures in the electronic device using adhesive. The adhesive may be patterned to form an unbonded area between at least some of the backlight unit or other structures to which the heat spreading layer is attached and the heat spreading layer. The heat spreading layer may be mounted adjacently to a housing structure such as a metal midplate member that is attached to housing walls in the housing. |
申请公布号 |
JP2016004782(A) |
申请公布日期 |
2016.01.12 |
申请号 |
JP20150108603 |
申请日期 |
2015.05.28 |
申请人 |
APPLE INC |
发明人 |
TYLER R KAKUDA;SHAWN R GETTEMY;MARK T SULLIVAN;IHTESHAM H CHOWDHURY |
分类号 |
F21S2/00;F21V29/503;F21V29/70;F21V29/87;F21V29/89;G02F1/1333;G02F1/13357 |
主分类号 |
F21S2/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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