| 摘要 |
PROBLEM TO BE SOLVED: To provide a phenolic resin foam having a low initial coefficient of thermal conductivity and maintains the low coefficient of thermal conductivity for a long term.SOLUTION: The phenolic resin foam contains cyclopentane and a high boiling point hydrocarbon with a boiling point of 190°C or more and 550°C or less, and has a density of 10 kg/mor more and 150 kg/mor less. A cyclopentane content in the phenolic resin foam is 0.25 or more and 0.85 mol or less per 22.4×10mof space volume in the phenolic resin foam. When the phenolic resin foam is pulverized in chloroform and an extraction treatment is performed, %Cof an oily component extracted in chloroform, as determined by a ring analysis n-d-M method, is 5% or less. |
