发明名称 |
SILICON CARBIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a silicon carbide semiconductor device and a manufacturing method of the same, which support reduction in channel resistance and reduction in JFET resistance at the same time.SOLUTION: A silicon carbide semiconductor device of the present invention comprises: a first conductivity type silicon carbide substrate; a first conductivity type drift layer on a principal surface of the silicon carbide substrate; and second conductivity type well regions which are provided at a distance from each other in a surface layer of the drift layer. The well region has a retrograde profile where a second conductivity type impurity concentration decreases in a range of up to 400 nm in a depth direction, from 1×10cmto a concentration equivalent with a first conductivity type impurity concentration in the drift layer. |
申请公布号 |
JP2016004955(A) |
申请公布日期 |
2016.01.12 |
申请号 |
JP20140125922 |
申请日期 |
2014.06.19 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
SADAMATSU YASUSHI;HINO SHIRO |
分类号 |
H01L29/78;H01L21/265;H01L21/266;H01L21/336;H01L29/12;H01L29/739 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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