发明名称 SILICON CARBIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a silicon carbide semiconductor device and a manufacturing method of the same, which support reduction in channel resistance and reduction in JFET resistance at the same time.SOLUTION: A silicon carbide semiconductor device of the present invention comprises: a first conductivity type silicon carbide substrate; a first conductivity type drift layer on a principal surface of the silicon carbide substrate; and second conductivity type well regions which are provided at a distance from each other in a surface layer of the drift layer. The well region has a retrograde profile where a second conductivity type impurity concentration decreases in a range of up to 400 nm in a depth direction, from 1×10cmto a concentration equivalent with a first conductivity type impurity concentration in the drift layer.
申请公布号 JP2016004955(A) 申请公布日期 2016.01.12
申请号 JP20140125922 申请日期 2014.06.19
申请人 MITSUBISHI ELECTRIC CORP 发明人 SADAMATSU YASUSHI;HINO SHIRO
分类号 H01L29/78;H01L21/265;H01L21/266;H01L21/336;H01L29/12;H01L29/739 主分类号 H01L29/78
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