| 主权项 |
1. A flexible LESD system comprising:
a light emitting semiconductor device comprising: a flexible dielectric layer having a first major surface with a first conductive layer thereon and having a second major surface with a second conductive layer thereon, the dielectric layer having one or both of a first and second via extending through the dielectric layer and a cavity or a third via extending from the first surface to, or toward, the second surface of the dielectric layer, the first conductive layer comprising conductive features in electrical contact with one or both of the first and second vias, the cavity or third via at least partially filled with conductive material, the second conductive layer comprising conductive features in electrical contact with one or both of the first and second vias; the cavity, or third via, being configured to receive a light emitting semiconductor; anda support article comprising:
a flexible dielectric layer having a first major surface and having a second major surface with a conductive layer thereon, the dielectric layer having at least two adjacent cavities or vias extending from the first major surface toward, or to, the second major surface, the two or more cavities or vias each configured to receive one or more bottom contacts of an LES package mounted on the support article, wherein contacts received by a single cavity or via have the same, or a neutral, polarity,wherein the conductive features of the second conductive layer of the light emitting semiconductor device make one or both of electrical and thermal connections in the cavities or vias of the support article. |
