发明名称 FinFET device containing a composite spacer structure
摘要 A composite spacer structure is formed on vertical sidewalls of a gate structure that is formed straddling a semiconductor fin. In one embodiment, the composite spacer structure includes an inner low-k dielectric material portion and an outer nitride material portion.
申请公布号 US9236397(B2) 申请公布日期 2016.01.12
申请号 US201414172365 申请日期 2014.02.04
申请人 GLOBALFOUNDRIES INC. 发明人 Holt Judson R.;Li Jinghong;Mehta Sanjay;Reznicek Alexander;Schepis Dominic J.
分类号 H01L27/12;H01L27/088;H01L21/8234;H01L29/16;H01L21/84;H01L29/66;H01L21/02;H01L21/265 主分类号 H01L27/12
代理机构 Scully, Scott, Murphy & Presser, P.C. 代理人 Scully, Scott, Murphy & Presser, P.C.
主权项 1. A method of forming a FinFET device comprising: providing a plurality of semiconductor fins on a surface of a substrate; forming at least one gate structure orientated perpendicular to and straddling each semiconductor fin of the plurality of semiconductor fins; providing a composite spacer structure on vertical sidewalls of each gate structure, wherein said composite spacer structure comprises an inner low-k dielectric material portion and an outer nitride material portion and wherein said providing said composite spacer structure comprises forming a dielectric spacer comprising a low-k dielectric material and converting an outer surface of the dielectric spacer into said outer nitride material portion, or depositing a graded spacer profile; and epitaxially growing a source-side doped semiconductor material portion on an exposed surface of each semiconductor fin and on one side of each gate structure and a drain-side doped semiconductor portion on another exposed surface of each semiconductor fin and on another side of each gate structure.
地址 Grand Cayman KY