发明名称 |
FinFET device containing a composite spacer structure |
摘要 |
A composite spacer structure is formed on vertical sidewalls of a gate structure that is formed straddling a semiconductor fin. In one embodiment, the composite spacer structure includes an inner low-k dielectric material portion and an outer nitride material portion. |
申请公布号 |
US9236397(B2) |
申请公布日期 |
2016.01.12 |
申请号 |
US201414172365 |
申请日期 |
2014.02.04 |
申请人 |
GLOBALFOUNDRIES INC. |
发明人 |
Holt Judson R.;Li Jinghong;Mehta Sanjay;Reznicek Alexander;Schepis Dominic J. |
分类号 |
H01L27/12;H01L27/088;H01L21/8234;H01L29/16;H01L21/84;H01L29/66;H01L21/02;H01L21/265 |
主分类号 |
H01L27/12 |
代理机构 |
Scully, Scott, Murphy & Presser, P.C. |
代理人 |
Scully, Scott, Murphy & Presser, P.C. |
主权项 |
1. A method of forming a FinFET device comprising:
providing a plurality of semiconductor fins on a surface of a substrate; forming at least one gate structure orientated perpendicular to and straddling each semiconductor fin of the plurality of semiconductor fins; providing a composite spacer structure on vertical sidewalls of each gate structure, wherein said composite spacer structure comprises an inner low-k dielectric material portion and an outer nitride material portion and wherein said providing said composite spacer structure comprises forming a dielectric spacer comprising a low-k dielectric material and converting an outer surface of the dielectric spacer into said outer nitride material portion, or depositing a graded spacer profile; and epitaxially growing a source-side doped semiconductor material portion on an exposed surface of each semiconductor fin and on one side of each gate structure and a drain-side doped semiconductor portion on another exposed surface of each semiconductor fin and on another side of each gate structure. |
地址 |
Grand Cayman KY |