| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing short-circuit between a screw and a lead.SOLUTION: There is provided a semiconductor device in which a mold IC 10 is fixed to a fixing part 30 by a screw 50. The mold IC comprises a lead 11, an electronic element 12 mounted on the lead, and an insulating coating part 13 that covers a part of the lead, and the electronic element. On a mounting surface 30a on which the coating part is mounted, of the fixing part, a recessed part 31 that is locally recessed is formed. A projection part 16 that protrudes from an opposed surface 13c opposed to the recessed part, of the coating part toward the recessed part is formed on the coating part. A screw hole 90 into which the screw is screwed is formed on each of the recessed part, the projection part, and a portion located above the projection part, of the coating part. In a state where the projection part is provided at the recessed part, the screw is screwed into the screw hole. |
