| 摘要 |
PROBLEM TO BE SOLVED: To develop an ultrasmall/ultrathin high-performance three-dimensional GMI sensor by solving a trade-off problem between a wire length and a magnetic field detection performance in the GMI sensor.SOLUTION: Solder joint and an assembly method such as a conductive post are combined with a fine coil, a combination unit element of a right-handed coil and a left-handed coil, a GMI element having a size of 0.2 mm and an integrated circuit chip, to thereby achieve simultaneously detectability improvement of a three-dimensional GMI sensor and micro-sizing. |
