发明名称 |
Multi-layered ceramic enclosure |
摘要 |
Techniques for fabricating a laminated ceramic housing that can be used for a handheld computing device that includes an enclosure having structural walls formed from a multi-layered ceramic material that can be radio-transparent. The multi-layered ceramic housing can be formed of a plurality of ceramic materials such as zirconia and alumina in any combination. The multi-layer ceramic substrate includes an inner layer and surface layers that sandwich the inner layer. The multi-layer ceramic substrate has an increased transverse strength due to the surface layers having a coefficient of thermal expansion (CTE) that is less than that of the inner layer. |
申请公布号 |
US9237661(B2) |
申请公布日期 |
2016.01.12 |
申请号 |
US201514691368 |
申请日期 |
2015.04.20 |
申请人 |
APPLE INC. |
发明人 |
Weber Douglas J. |
分类号 |
H05K5/00;B32B37/14;B32B18/00;G06F1/16 |
主分类号 |
H05K5/00 |
代理机构 |
Brownstein Hyatt Farber Schreck, LLP |
代理人 |
Brownstein Hyatt Farber Schreck, LLP |
主权项 |
1. A ceramic laminate enclosure for an electronic device, comprising:
an integral body defining a cavity to receive components of the electronic device, the integral body comprising:
an external surface layer in compressive stress and having a first coefficient of thermal of expansion;an internal surface layer defining at least a portion of the cavity, the internal surface layer in compressive stress and having the first coefficient of thermal of expansion; andan intermediate layer between the external surface layer and the internal surface layer, the intermediate layer in tension and having a second coefficient of thermal of expansion that is greater than the first coefficient of thermal expansion, wherein a transition region between the external surface layer and the internal surface layer has a stepped residual stress profile. |
地址 |
Cupertino CA US |