Semiconductor device and method for manufacturing the same

摘要

The present invention has a tray corresponding to a heat sink, a circuit part is accommodated in an accommodating part of the tray, and the circuit part is potting-sealed with a sealing resin such that external electrodes are exposed. The sealing resin covers and seals a top part of the tray.

主权项

1. A semiconductor device comprising:
a tray configured to have an accommodating part with a concave shape such that the accommodating part opens in an upward direction relative to the tray; a circuit part configured to be housed in the accommodating part and have a semiconductor element and wiring members; and a sealing resin configured to be injected in the accommodating part and seal, in potting, the circuit part housed in the accommodating part and side wall top parts of the tray, the wiring members being partially exposed out of a top surface of the sealing resin, the top surface facing in the upward direction, to form external electrodes, and the sealing resin having a heat resistant temperature which is higher than the melting point of a solder for bonding the tray to a cooling device.