| 主权项 |
1. A laser processing method of applying a pulsed laser beam to a workpiece having a plurality of members, thereby forming a laser processed groove on said workpiece, said laser processing method comprising:
a processing conditions setting step of setting a plurality of processing conditions respectively corresponding to a plurality of different materials forming said plurality of members constituting said workpiece, wherein said processing conditions setting step includes storing, in a memory, a processing conditions map in which a plurality of said different materials are each mapped to both a repetition frequency of the pulsed laser and a power of the pulsed laser; a wavelength detecting step of detecting the wavelengths of plasma lights generated by applying said pulsed laser beam to said plurality of members constituting said workpiece; a processing condition selecting step of selecting, from said processing conditions map, any suitable one of said processing conditions corresponding to any one of said members corresponding to the wavelength of plasma lights detected by said wavelength detecting step; and a laser processing step of applying said pulsed laser beam to said workpiece under the processing condition selected by said processing condition selecting step, thereby forming said laser processed groove on said workpiece, wherein said plurality of different materials comprises four different materials, defined as a first material, a second material, a third material and a fourth material; and wherein said wavelength detecting step comprises:
directing plasma light generated by applying said pulsed laser beam to a first beam splitter that branches said plasma light into a first path and a second path;directing said first path of said plasma light to a second beam splitter that branches said first path into a third path and a fourth path;directing said second path of plasma light to a third beam splitter that branches said second path into a fifth path and a sixth path;directing said third path of said plasma light through a first bandpass filter corresponding to a first wavelength, and then directing any plasma light corresponding to said first wavelength passing through said first bandpass filter to a first photodetector;directing said fourth path of said plasma light through a second bandpass filter corresponding to a second wavelength, and then directing any plasma light corresponding to said second wavelength passing through said second bandpass filter to a second photodetector;directing said fifth path of said plasma light through a third bandpass filter corresponding to a third wavelength, and then directing any plasma light corresponding to said third wavelength passing through said third bandpass filter to a third photodetector; anddirecting said sixth path of said plasma light through a fourth bandpass filter corresponding to a fourth wavelength, and then directing any plasma light corresponding to said fourth wavelength passing through said fourth bandpass filter to a fourth photodetector;wherein said first wavelength corresponds to said first material, said second wavelength corresponds to said second material, said third wavelength corresponds to said third material, and said fourth wavelength corresponds to said fourth material. |
