| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible wiring board that can suppress dimensional variation of a copper clad laminate by simple means irrespective of variation of the humidity of an environment to which the copper clad laminate is exposed in a process of manufacturing a flexible wiring board from the copper clad laminate.SOLUTION: In a method of manufacturing a flexible wiring board that performs wiring processing on an elongated double-layered copper clad laminate 6 in which a base metal layer 2 and a copper layer 5 are laminated on at least one surface of an elongated polyimide film 1 through no adhesive agent, the elongated polyimide film 1 is formed of polyimide containing imide bonds comprising aromatic diamine and 3,3'-4,4-diphenyl tetracarboxylic acid dianhydride. When the humidity of an environment to which the double-layered copper clad laminate 6 is exposed varies in the range of ±5%RH, The double-layered copper clad laminate 6 is left for nine hours or more under the environment of the varied humidity, and then a next step is executed. |
