发明名称 CONDUCTIVE RESIN PASTE AND CERAMIC ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a conductive resin paste capable of forming a resin electrode layer having small rate of temporal change of specific resistance without generating migration of a conductive component even when used under high temperature environment, and to provide a ceramic electronic part having high credibility where the resin electrode layer is formed by using the conductive resin paste.SOLUTION: There is provided a conductive resin paste containing a conductive component and a resin component, the conductive component having a structure containing at least Ag and Cu with a percentage of Ag based on the total amount of Ag and Cu contained in the conductive component in a range of 11.6 to 28.8 mass%. As the conductive component, one consisting of Ag coated Cu powder where at least a part of a surface of Cu powder is coated by Ag is used, the Ag coated Cu powder contains ones having different shapes and the Ag coated Cu powder contains spherical and flaky Ag coated Cu powder. Also, the conductive resin paste contains two or more kind of Ag coated Cu powder having different Ag and Cu ratios.
申请公布号 JP2016004659(A) 申请公布日期 2016.01.12
申请号 JP20140123562 申请日期 2014.06.16
申请人 MURATA MFG CO LTD 发明人 ZENSAI KOTA;TERASHITA YOSUKE
分类号 H01B1/22;H01B1/00;H01G4/232;H01G4/30 主分类号 H01B1/22
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