发明名称 High electron mobility transistor and method of forming the same
摘要 A semiconductor structure includes a first III-V compound layer. A second III-V compound layer is disposed on the first III-V compound layer and is different from the first III-V compound layer in composition. A carrier channel is located between the first III-V compound layer and the second III-V compound layer. A source feature and a drain feature are disposed on the second III-V compound layer. A gate electrode is disposed over the second III-V compound layer between the source feature and the drain feature. A fluorine region is embedded in the second III-V compound layer under the gate electrode. A diffusion barrier layer is disposed on top of the second III-V compound layer. A gate dielectric layer is disposed over the second III-V compound layer. The gate dielectric layer has a fluorine segment on the fluorine region and under at least a portion of the gate electrode.
申请公布号 US9236465(B2) 申请公布日期 2016.01.12
申请号 US201414511627 申请日期 2014.10.10
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Liu Po-Chun;Yu Chung-Yi;Chen Chi-Ming
分类号 H01L31/0256;H01L29/778;H01L29/423;H01L29/66;H01L29/20;H01L21/02;H01L21/768;H01L29/201;H01L29/205 主分类号 H01L31/0256
代理机构 Slater & Matsil, L.L.P. 代理人 Slater & Matsil, L.L.P.
主权项 1. A semiconductor structure comprising: a first III-V compound layer; a second III-V compound layer disposed on the first III-V compound layer and different from the first III-V compound layer in composition; a third III-V compound layer disposed over the second III-V compound layer, wherein a diffusion barrier layer is interposed between the second III-V compound layer and the third III-V compound layer; and a source contact and a drain contact disposed on the second III-V compound layer, wherein the third III-V compound layer and the diffusion barrier layer are interposed between the source contact and the drain contact.
地址 Hsin-Chu TW
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