Thermally-conductive organic additive, resin composition, and cured product

摘要

A resin composition includes
(A) a thermally-conductive organic additive including a liquid crystalline thermoplastic resin which has a mainly-chain structure, wherein a main chain of the liquid crystalline thermoplastic resin contains mainly a repeating unit represented by the general formula (1):
-M-Sp-  (1)
where M represents a mesogenic group and Sp represents a spacer,
(B) a thermosetting resin; and(C) an inorganic filler.

主权项

1. A resin composition comprising:
(A) a thermally-conductive organic additive consisting of a liquid crystalline thermoplastic resin which has a mainly-chain structure, wherein a main chain of the liquid crystalline thermoplastic resin contains mainly a repeating unit represented by the general formula (2) and (ii) per se has a thermal conductivity of not less than 0.45 W/(m·K);
-A1-x-A2-y-R-z  (2) wherein each of A1 and A2 independently represents a substituent group selected from an aromatic group, a condensed aromatic group, an alicyclic group, and an alicyclic heterocyclic group; x represents a direct bond, or a bivalent substituent group selected from the group consisting of —CH2—, —C(CH3)2—, —O—, —S—, —CH-2—CH2—, —C═C—, —C≡C—, —CO—, —CO—O—, —CO—NH—, —CH═N—, —CH═N—N═CH—, —N═N—, and —N(O)═N—; R represents a bivalent substituent group which has a main chain length of 2 to 20 atoms and may be branched; and -y-R-z is —O—CO—R—CO—O—, (B) a thermosetting resin; and (C) an inorganic filler.