| 摘要 |
The present invention is to provide an aging method using a brush aging apparatus for cleaning a semiconductor wafer, to stably clean a semiconductor wafer by aging the surface of a brush which is replaced for a certain period in a semiconductor wafer cleaning device. The brush aging apparatus for cleaning a semiconductor wafer includes: a processing room which is opened and closed with a cover, and has a brush provided in detachable and water-tight manner on a chuck rotatably provided on opposite sides, wherein a motor is connected to one chuck and a cleaning water supply conduit is connected to the other chuck; a whetstone that is installed inside the processing room, and aging while being in contact with a circumferential surface of the brush; a handle member that moves the whetstone in the processing room; a reservoir tank that is installed in a lower part of the processing room, to store cleaning water therein; a transfer pump that feeds the cleaning water stored in the reservoir tank by transferring the water via the cleaning water supply conduit; and a water purifier that collects and purifies, with a purifying filter, the cleaning water used for cleaning and supplies the reservoir tank with the purified water. The aging method using the brush aging apparatus for cleaning a semiconductor wafer comprises: installing a brush on the both chucks inside the processing room and then sealing the processing room by closing the cover; continuously providing cleaning water in the reservoir tank to the inside the brush through the cleaning water supply conduit with a transfer pump; moving, with the handle member, the whetstone inside the processing room to be in contact with a circumferential surface of the brush; and rotating, with the motor, the brush coupled to the both chucks to age the circumferential surface of the brush by being in contact with the whetstone. |
