| 摘要 |
A printed wiring board in which a surface mount device is mounted on an insulating base material using reflow type soldering that uses solder paste, includes a first surface on which the surface mount device is mounted; and a second surface on an opposite side to the first surface, wherein a venting hole penetrating from the first surface to the second surface is formed, and the venting hole is formed directly below the surface mount device. |
