| 摘要 |
A system for testing a wafer includes multiple test devices and one alignment server. Each of the test devices includes a card mounting unit on which a probe card for testing a electrical performance of semiconductor chips produced from multiple wafers is mounted; a wafer stage on which each of the wafers is placed to face the probe card; an alignment unit which is connected to at least one from the card mounting unit and the wafer stage, and aligns the probe card and the wafer; and a test unit which allows the probe card to be connected to each of the wafers to perform a test. The alignment server is connected to the test devices in a parallel structure, and alignment data for aligning the probe card and each of the wafers is stored therein. |
