| 摘要 |
<p>The present invention relates to a method and a device (1) for joining conductors (10) to substrates (20). The device (1) comprises at least one positioning unit (40) which positions a conductor (10) in a section (33) to be connected on or near the substrate (20). A plasma (51) is generated in at least one plasma source (50). At least one feed line (55) serves for feeding a connecting material (30) into the plasma (51) of the plasma source (50). Furthermore, a plurality of devices (1) according to the present invention can be combined in a system which is designed for the parallel processing of one or a plurality of substrates (20).</p> |
