METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

Embodiments provide methods of manufacturing a semiconductor device. The method includes forming an interlayer insulating layer on a substrate; forming a plurality of contact holes penetrating the interlayer insulating layer, the plurality of contact holes arranged along a first direction and a second direction perpendicular to the first direction; and forming contacts in the contact holes, each contact hole being formed using a photo mask that is distinct from a photo mask used for forming a contact hole immediately adjacent to each contact hole in the first direction and distinct from a photo mask used for forming a contact hole immediately adjacent to each contact hole in the second direction, and top surfaces of the contacts being at a same level from the substrate.

主权项

1. A method of manufacturing a semiconductor device, the method comprising:
forming an interlayer insulating layer on a substrate; forming a plurality of contact holes penetrating the interlayer insulating layer, the plurality of contact holes arranged along a first direction and a second direction perpendicular to the first direction; and forming contacts in the contact holes, each contact hole being formed using a photo mask that is distinct from a photo mask used for forming a contact hole immediately adjacent to each contact hole in the first direction and distinct from a photo mask used for forming a contact hole immediately adjacent to each contact hole in the second direction, and top surfaces of the contacts being at a same level from the substrate.