| 发明名称 |
COIL UNIT FOR THIN FILM INDUCTOR, MANUFACTURING METHOD OF COIL UNIT FOR THIN FILM INDUCTOR, THIN FILM INDUCTOR AND MANUFACTURING METHOD OF THIN FILM INDUCTOR |
| 摘要 |
A coil unit for the thin film inductor includes an insulating material and a coil pattern. The coil pattern includes an inner plating layer embedded in the insulating layer, a growth conductive layer formed on a surface of the inner plating layer and formed on a top surface and a bottom surface of the insulating layer and an outer plating layer formed on the top surface and the bottom surface of the insulating material by plating and growing based on the growth conductive layer. |
| 申请公布号 |
US2016005527(A1) |
申请公布日期 |
2016.01.07 |
| 申请号 |
US201514789713 |
申请日期 |
2015.07.01 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK Jeong Woo;KIM Dong Min |
| 分类号 |
H01F27/28;C25D7/00;C25D5/10;H01F41/04;C25D5/12 |
主分类号 |
H01F27/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A coil unit for a thin film inductor comprising:
an insulating material and a coil pattern, wherein the coil pattern includes: an inner plating layer embedded in the insulating layer; a growth conductive layer formed on a surface of the inner plating layer and formed on a top surface and a bottom surface of the insulating layer; and an outer plating layer formed on the top surface and the bottom surface of the insulating material by plating and growing based on the growth conductive layer. |
| 地址 |
Suwon-Si KR |
