| 摘要 |
The purpose of the present invention is to improve the measurement accuracy of a thermal air flowmeter. The thermal air flowmeter is equipped with a sensor assembly having a lead frame, a plate provided on the lead frame, a sensor chip provided on the plate, and a resin provided so as to expose a diaphragm portion of the sensor chip, wherein the diaphragm portion is provided so as to be positioned in a sub-passage. In the thermal air flowmeter, the plate has a groove or a partially thin reduced thickness portion outside a sensor chip mounting surface region where the plate receives a press load from the sensor chip during resin molding. Alternatively, in another embodiment, the side surface of the plate is substantially flush with the side surface of the sensor chip at least in the sensor chip mounting region. |
