发明名称 PLASMA PROCESSING APPARATUS, PLASMA PROCESSING APPARATUS APPLICATION METHOD AND POWER SUPPLY DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a plasma processing apparatus for performing a plasma treatment on a body to be processed.SOLUTION: A plasma processing apparatus of one embodiment, comprises a processing container, a mounting table, a plurality of heaters and a power supply device. The mounting table is provided in the processing container. The plurality of heaters are provided in the mounting table. The power supply device supplies power to the plurality of heaters. The power supply device has a plurality of transformers and a plurality of zero-cross control solid-state relays (SSR). The plurality of transformers are constituted to lower voltage from an AC power supply. Each of the plurality of transformers has a primary coil and a secondary coil. The primary coil is connected to the AC power supply. Each of the plurality of SSRs is provided between one corresponding heater of the plurality of heaters and the secondary coil of one corresponding transformer of the plurality of transformers.
申请公布号 JP2016001638(A) 申请公布日期 2016.01.07
申请号 JP20140120251 申请日期 2014.06.11
申请人 TOKYO ELECTRON LTD 发明人 SHONAI REI
分类号 H01L21/3065;H01L21/683;H05B3/00;H05H1/46 主分类号 H01L21/3065
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