发明名称 PVD PROCESSING APPARATUS AND PVD PROCESSING METHOD
摘要 A PVD processing apparatus and method capable of forming a composite coating having a coating thickness with excellent circumferential uniformity on an outer peripheral surface of a substrate. The PVD processing apparatus includes: a vacuum chamber; a revolving table revolving a plurality of substrates around an revolution axis in the vacuum chamber; a plurality of rotating tables rotating the substrates about their rotation axis parallel to the revolution axis on the revolution table; a plurality of types of targets provided radially outside the revolving table at circumferentially spaced positions; and a table rotating mechanism rotating the rotating table by an angle of 180° or more while the substrates passes through a region between two tangent lines drawn from a center of the target to an arc enveloping the rotating tables.
申请公布号 US2016002769(A1) 申请公布日期 2016.01.07
申请号 US201414768519 申请日期 2014.03.03
申请人 KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.) 发明人 FUJII Hirofumi
分类号 C23C14/50;C23C14/32;C23C14/34 主分类号 C23C14/50
代理机构 代理人
主权项 1. A PVD processing apparatus for performing coating formation on respective surfaces of a plurality of substrates, the PVD processing apparatus comprising: a vacuum chamber containing therein the plurality of substrates; a revolving table provided in the vacuum chamber and configured to support the plurality of substrates and to revolve the supported substrates around a revolution axis; a plurality of rotating tables configured to support respective substrates of the plurality of substrates and rotating the supported substrates, on the revolving table, about their respective rotation axes parallel to the revolution axis; a plurality of targets formed of respective different types of coating-formation materials, the targets disposed at respective positions circumferentially spaced on radial outside of the revolving table; and a table rotating mechanism for rotating each of the rotating tables about its rotation axis, the table rotating mechanism configured to rotate the rotating table, on which the substrate is placed, about its rotation axis by an angle of 180° or more relatively to the revolving table while the substrate passes through a region between two tangent lines drawn from a center of each of the targets to an arc enveloping the rotating tables.
地址 Kobe-shi, Hyogo JP