| 发明名称 |
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD |
| 摘要 |
A laser processing apparatus that condenses a laser beam into an annular shape to irradiate the condensing position of the laser beam within a thickness range of a substrate, and shifts the condensing position in such a manner that the center of the condensing position that is annular moves in a circular manner, at a stage of shifting the condensing position in a thickness direction of the substrate and a planar direction of the substrate. |
| 申请公布号 |
US2016002088(A1) |
申请公布日期 |
2016.01.07 |
| 申请号 |
US201414765233 |
申请日期 |
2014.02.03 |
| 申请人 |
V TECHNOLOGY CO., LTD. |
发明人 |
Mizumura Michinobu;Takimoto Masami;Matsuyama Shota |
| 分类号 |
C03B33/10;G02B7/02;C03C23/00;G02B19/00 |
主分类号 |
C03B33/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A laser processing apparatus for performing a through-hole process on a substrate by irradiating the substrate with a laser beam, the laser processing apparatus comprising:
a condensing lens that condenses the laser beam into an annular shape to irradiate a condensing position of the laser beam within a thickness range of the substrate; and a condensing position shifting unit that shifts the condensing position in a thickness direction of the substrate and a planar direction of the substrate. |
| 地址 |
Kanagawa JP |
