HEAT-DISSIPATING COMPONENT AND METHOD FOR MANUFACTURING SAME

摘要

[Problem] To provide a heat-dissipating component for minimizing damage such as cracking and breaking of through-holes and surrounding areas when the heat-dissipating component is to be secured to another component or is in actual use after being secured, and suppressing the formation of shrinkage cavities or hollow cavities during manufacture; and to provide a method for manufacturing said component. [Solution] Provided is a heat-dissipating component, and a method for manufacturing the same, said component characterized in being provided with a compounded section including a tabular molded body containing silicon carbide, and a hole-formation section formed in a circumferential edge section of the compounded section; through-holes being formed in the hole formation section; the hole-formation sections containing inorganic fibers; the molded body and the inorganic fibers being impregnated with an aluminum-containing metal; and the hole-formation section forming a part of the outer peripheral surface of the heat-dissipating component.