| 摘要 |
The present invention relates to a deposition apparatus in a vaporizing position varied type, which can adjust a vaporizing position corresponding to a deposition condition in one chamber. According to the present invention, the deposition apparatus comprises: a chamber for providing a space in which a deposition material is deposited for a substrate; a vaporization source for vaporizing the deposition material to deposit the deposition material on a surface of the substrate positioned in the chamber; and a vaporization position adjusting unit for changing the deposition distance in the chamber according to the deposition condition for the substrate, wherein the deposition distance is from the center of the substrate to the vaporization source. Since the deposition apparatus of the present invention can adjust the deposition position corresponding to various deposition conditions in one chamber, a plurality of deposition apparatuses are not necessary to be equipped, costs for facilities or the like can be reduced, and also, a deposition process time can be reduced since a deposition process can be performed according to various conditions in one chamber. |
