发明名称 |
ELECTRONIC SUBSTRATE WITH HEAT DISSIPATION STRUCTURE |
摘要 |
An electronic substrate with heat dissipation structure includes a substrate plate and at least one heat pipe. The substrate plate includes a wiring layer, a grounding layer and an insulation layer from top to bottom. The wiring layer has at least one heat-producing element mounted thereon, and is formed with a receiving hole for the heat pipe to tightly fit therein. Heat produced by the heat-producing element and distributed over a high-temperature zone of the substrate plate surrounding the heat-producing element is absorbed by the heat pipe and then transferred to a low-temperature zone of the substrate plate distant from the heat-producing element, from where the heat is dissipated into ambient air to achieve cooling effect at upgraded heat dissipation efficiency. |
申请公布号 |
US2016007504(A1) |
申请公布日期 |
2016.01.07 |
申请号 |
US201414322906 |
申请日期 |
2014.07.02 |
申请人 |
ASIA VITAL COMPONENTS CO., LTD. |
发明人 |
Wu Chun-Ming |
分类号 |
H05K7/20;G06F1/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
1. An electronic substrate with heat dissipation structure, comprising:
a substrate plate including a wiring layer, a grounding layer and an insulation layer; the wiring layer having a first side surface and an opposite second side surface, and being provided with a receiving hole; the first side surface having at least one heat-producing element mounted thereon, and the receiving hole provided on the wiring layer being extended from a position in the vicinity of the heat-producing element to another position distant from the heat-producing element while vertically extending through the first and the second side surface of the wiring layer; the grounding layer having an upper side facing toward the wiring layer and attached to the second side surface, and a lower side facing away from the wiring layer; and the insulation layer having an upper side facing toward and attached to the lower side of the grounding layer, and a lower side facing away from the grounding layer; and at least one heat pipe being tightly fitted in the receiving hole with a lower surface of the heat pipe in full contact with the upper side of the grounding layer; the heat pipe including a heat-absorption section and a heat-transfer section extended from the heat-absorption section; the heat-absorption section being fitted in a portion of the receiving hole located adjacent to the heat-producing element, and the heat-transfer section being fitted in another portion of the receiving hole located distant from the heat-producing element. |
地址 |
New Taipei City TW |