发明名称 |
METHOD FOR FORMING ELECTRICALLY CONDUCTIVE ULTRAFINE PATTERN, ELECTRICALLY CONDUCTIVE ULTRAFINE PATTERN, AND ELECTRIC CIRCUIT |
摘要 |
There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method. |
申请公布号 |
US2016007477(A1) |
申请公布日期 |
2016.01.07 |
申请号 |
US201414769574 |
申请日期 |
2014.03.06 |
申请人 |
DIS CORPORATION |
发明人 |
Yoshihara Sunao;Katsuta Haruhiko;Katayama Yoshinori;Shirakami Jun;Murakawa Akira;Fujikawa Wataru;Saitou Yukie |
分类号 |
H05K3/18;C25D5/02;H05K3/12;H05K1/09;H05K1/03;C25D5/56;C25D7/00 |
主分类号 |
H05K3/18 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method for forming an electrically conductive ultrafine pattern, the method comprising:
(1) a step of applying a resin composition (a) to form a receiving layer (A) on a substrate; (2) a step of printing an ink (b) containing particles (b1) to be formed into plating cores by a reverse offset printing method to form a plating core pattern (B) on the receiving layer (A); and (3) a step of depositing a metal on the plating core pattern (B) formed in the step (2) by an electrolytic plating method. |
地址 |
Itabashi-ku, Tokyo JP |