CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

摘要

A circuit substrate includes a core substrate having cavity, metal blocks in the cavity, first and second build-up layers including insulating layers and laminated on first and second sides of the core substrate such that the insulating layers are covering the cavity, and a filling resin filling gap formed between the cavity and metal blocks in the cavity. The cavity is penetrating through the core substrate, the core substrate has an intracavity projection structure projecting from one or more side surfaces of the cavity such that the projection structure is positioned between the metal blocks and separating the metal blocks from contacting each other in the cavity, the first build-up layer has first conductors connected to the metal blocks such that each first conductor conducts electricity or heat, and the second build-up layer has second conductors connected to the metal blocks such that each second conductor conducts electricity or heat.

主权项

1. A circuit substrate, comprising:
a core substrate having a cavity; a plurality of metal blocks accommodated in the cavity of the core substrate; a first build-up layer comprising an insulating resin layer and laminated on a first side of the core substrate such that the insulating resin layer is covering the cavity of the core substrate; a second build-up layer comprising an insulating resin layer and laminated on a second side of the core substrate such that the insulating resin layer is covering the cavity of the core substrate; and a filling resin filling a gap formed between the cavity and the metal blocks positioned in the cavity of the core substrate, wherein the cavity of the core substrate is penetrating through the core substrate, the core substrate has an intracavity projection structure projecting from at least one side surface of the cavity such that the intracavity projection structure is positioned between the metal blocks and separating the metal blocks from contacting each other in the cavity of the core substrate, the first build-up layer has a plurality of first conductors connected to the plurality of metal blocks, respectively, such that each of the first conductors conducts one of electricity and heat, and the second build-up layer has a plurality of second conductors connected to the plurality of metal blocks, respectively, such that each of the second conductors conducts one of electricity and heat.