| 摘要 |
PROBLEM TO BE SOLVED: To prevent an adhesive film for die bonding which is finely crushed when fracturing the adhesive film attached to a rear face of a wafer from directly adhering to a surface of a semiconductor device.SOLUTION: A wafer processing method comprises: a wafer support process of attaching an adhesive film 6 to a rear face of a wafer and attaching a dicing tape T on the adhesive film side and supporting a periphery of the dicing tape with an annular frame F; an adhesive film fracturing process of expanding the dicing tape and fracturing the adhesive film along individual devices 22; and a protection film formation process of coating a surface of the wafer or a periphery of the adhesive film protruding from an outer peripheral edge of the wafer, or the surface of the wafer and the periphery of the adhesive film protruding from the outer peripheral edge of the wafer with aquaresin to form a protection film 8 before performing the adhesive film fracturing process. |
