发明名称 |
FINFET WITH CONFINED EPITAXY |
摘要 |
Embodiments of the present invention provide a fin-type field effect transistor (finFET) with confined epitaxy. A protective layer is formed on a fin. The protective layer is recessed to expose the fin top. A fin cavity is formed in the fin. An epitaxial region is formed in the fin cavity. The epitaxial region has a confined portion and a diamond-shaped portion, resulting in increased epitaxial volume. The increased epitaxial volume can result in enhanced carrier mobility and improved device performance. |
申请公布号 |
US2016005868(A1) |
申请公布日期 |
2016.01.07 |
申请号 |
US201414320932 |
申请日期 |
2014.07.01 |
申请人 |
GLOBALFOUNDRIES Inc. |
发明人 |
Wei Andy Chih-Hung;Wan Jing;Choi Dae-Han |
分类号 |
H01L29/78;H01L21/306;H01L29/10;H01L29/66 |
主分类号 |
H01L29/78 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method of forming a semiconductor structure comprising:
forming a fin on a semiconductor substrate; forming a shallow trench isolation layer on the semiconductor substrate, wherein the shallow trench isolation layer is adjacent with a lower section of the fin; depositing a protective layer on the fin; removing a portion of the protective layer such that a top portion of the fin is exposed while sidewalls of the fin remain covered; forming a fin cavity in the fin; and depositing a semiconductor material in the fin cavity. |
地址 |
Grand Cayman KY |