Semiconductor Package and Method for Manufacturing the Same

摘要

Provided is a semiconductor package including: a substrate; an image sensor chip disposed on the substrate and including a first surface that faces the substrate and a second surface that is opposed to the first surface; an adhesion layer interposed between the substrate and the image sensor chip; and a first cavity surrounded by the first surface, an upper surface of the substrate and a side surface of the adhesion layer. The first surface includes a first central portion and a first edge portion, the adhesion layer includes a first adhesion part directly contacting the first central portion and a second adhesion part directly contacting the substrate, and the first adhesion part has an area corresponding to about 5% to about 50% of an area of the first surface.

主权项

1. A semiconductor package comprising:
a substrate; an image sensor chip disposed on the substrate and including a first surface that faces the substrate and a second surface that is opposed to the first surface; an adhesion layer interposed between the substrate and the image sensor chip; and a first cavity surrounded by the first surface of the image sensor chip, an upper surface of the substrate and a side surface of the adhesion layer, wherein the first surface of the image sensor chip comprises a first central portion and a first edge portion, and the adhesion layer comprises a first adhesion portion directly contacting the first central portion and a second adhesion portion directly contacting the upper surface of the substrate, wherein the first adhesion portion has an area of about 5% to about 50% of an area of the first surface of the image sensor chip.