| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device includes: a substrate including a base member having a main surface and a back surface facing opposite in a thickness direction; a semiconductor element mounted on the main surface of the substrate and having at least one element pad; a wire having a bonding portion bonded to the element pad; and a sealing resin formed on the main surface of the substrate for covering the wire and at least a portion of the semiconductor element. The semiconductor element has an element exposed side surface that faces in a direction crossing the thickness direction of the substrate and is exposed from the sealing resin. |
| 申请公布号 |
US2016005708(A1) |
申请公布日期 |
2016.01.07 |
| 申请号 |
US201514755334 |
申请日期 |
2015.06.30 |
| 申请人 |
ROHM CO., LTD. |
发明人 |
NISHIYAMA Yuto;HAGA Motoharu |
| 分类号 |
H01L23/00;G01R33/02;H01L21/78;H01L23/31;H01L21/56 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a substrate including a base member having a main surface and a back surface facing opposite in a thickness direction; a semiconductor element having at least one element pad and mounted on the main surface of the substrate; a wire having a bonding portion bonded to the element pad; and a sealing resin formed on the main surface of the substrate, and covering the wire and at least a portion of the semiconductor element, wherein the semiconductor element includes an element exposed surface that faces in a direction crossing the thickness direction of the substrate and is exposed from the sealing resin. |
| 地址 |
Kyoto-shi JP |
