METHOD AND APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

A method for fabricating a semiconductor device includes obtaining first raw data by measuring an overlay of a semiconductor wafer of a first lot and generating a regression equation based on the first raw data. A semiconductor wafer of a second lot is aligned based on a coefficient of the regression equation, second raw data is obtained by measuring an overlay of the aligned semiconductor wafer of the second lot, and the regression equation is corrected based on the second raw data. Correction of the regression equation includes dividing the regression equation into an initial equation and a residual equation excluding the initial equation from the regression equation, correcting a coefficient of the initial equation; and correcting a coefficient of the residual equation.

主权项

1. A method of fabricating a semiconductor device, the method comprising:
obtaining first raw data by measuring an overlay of a semiconductor wafer of a first lot; generating a regression equation based on the first raw data; aligning a semiconductor wafer of a second lot based on a coefficient of the regression equation; obtaining second raw data by measuring an overlay of the aligned semiconductor wafer of the second lot; and correcting the regression equation based on the second raw data, wherein the correcting of the regression equation includes: dividing the regression equation into an initial equation and a residual equation excluding the initial equation from the regression equation; correcting a coefficient of the initial equation by performing a first regression analysis of the initial equation based on the second raw data; and correcting a coefficient of the residual equation by applying the coefficient of the initial equation to the regression equation and performing a second regression analysis of the regression equation having the coefficient of the initial equation.