发明名称 METHOD FOR PRODUCING WIRING BOARD, AND WIRING BOARD
摘要 The present invention addresses the problem of providing a technique which is capable of easily forming a resin opening of a desired shape. As a solution, a base (18) which has a first surface region (12) and a second surface region (14) around the first surface region (12), and which is provided with a wiring line (16) is prepared. Subsequently, a resist (20) which covers the first surface region (12) is formed. Then, the first surface region (12) and the second surface region (14) are covered with a resin body (22) such that the resist (20) is contained therein, and the resist (20) is exposed from the resin body (22). After that, the exposed resist (20) is removed, so that a resin opening, from which the base (18) in the first surface region (12) is exposed, is formed in the resin body (22).
申请公布号 WO2016002360(A1) 申请公布日期 2016.01.07
申请号 WO2015JP64044 申请日期 2015.05.15
申请人 KABUSHIKI KAISHA EASTERN 发明人 NARISAWA, YOSHIAKI
分类号 H01L23/12;H05K1/18;H05K3/28 主分类号 H01L23/12
代理机构 代理人
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