BONDING METHOD, METHOD FOR MANUFACTURING STRUCTURE, AND STRUCTURE

摘要

Provided is a bonding method (S1) whereby, even in a case where a thin film (12) comprising gold is formed on the surface of a first member (11), a strong bonding force can be obtained without requiring any special treatment on a second member (14). The thin film (12) comprising gold is formed on the surface of the first member (11), said first member (11) comprising a material other than gold. The bonding method (S1) comprises: an irradiation step (S11) for irradiating laser beam at least to a part of a specific area (12a) of the surface of the first member (11) to thereby expose the base of the thin film (12) at least in a part of the specific area (12a); and a bonding step (S12) for bonding the second member (14) to the specific area (12a) using an adhesive (13).