| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing a variation accompanying mounting and a manufacturing method of the same.SOLUTION: The semiconductor device includes: a substrate 101; a conductive film 103 on the substrate 101. On the substrate 101, a via hole 111 that penetrates from a front surface to a rear surface and is closed by the conductive film 103 is formed. Between the substrate 101 and the conductive film 103, a hole 120 that connects a space inside the via hole 111 and a space above the front surface is formed. |
