| 摘要 |
PROBLEM TO BE SOLVED: To automatically manufacture the peeling start for peeling an all-layer build-up substrate from a carrier without generating deformation, damage, and defects on the all-layer build-up substrate formed on the carrier.SOLUTION: Disclosed is a device for manufacturing the peeling start, which is for peeling all-layer build-up substrates (2, 4) in a build-up substrate (1) forming the all-layer build-up substrates (2,4) on a carrier (3) from the carrier (3). This device includes: means for acquiring a position coordinate on a peeling interface between the all-layer build-up substrates (2, 4) and the carrier (3) by an image sensor; and means for piercing a leading blade (5) into the acquired position coordinate on the peeling interface. |
