CHIP-TYPE ANTENNA DEVICE AND CHIP STRUCTURE

摘要

A chip structure for mounting on a clearance area of a printed circuit board includes a packaged chip and a monopole coupling antenna. The packaged chip has an insulating body, an electronic component embedded in the insulating body, and a plurality of grounding pads electrically connected to the electronic component. The monopole coupling antenna has a grounding radiating metal and a monopole radiating metal. The packaged chip is electrically connected to the grounding radiating metal by the grounding pads. The monopole radiating metal is disposed on the insulating body and spaced apart from the electronic component and the grounding radiating metal. The monopole radiating metal is configured to couple the grounding radiating metal and the electronic component by using a feeding circuit to connect the packaged chip and the monopole radiating metal and using a grounding circuit to connect the grounding radiating metal and the printed circuit board.

主权项

1. A chip-type antenna device, comprising:
a circuit board having a grounding portion; a packaged chip having an insulating body and at least one electronic component embedded in the insulating body, wherein the packaged chip has a plurality of grounding pads and a plurality of signal pads, the grounding pads and the signal pads are exposed from the insulating body and are electrically connected to the electronic component; a monopole coupling antenna, comprising:
a grounding radiating metal disposed on the circuit board, wherein the grounding pads are connected to the grounding radiating metal; anda monopole radiating metal disposed on the insulating body of the packaged chip, the monopole radiating metal having a feeding point, wherein the monopole radiating metal is arranged apart from the electronic component and the grounding radiating metal; a grounding circuit disposed on the circuit board and connected to the grounding portion of the circuit board and the grounding radiating metal; and a feeding circuit electrically connected to the feeding point of the monopole radiating metal and one of the signal pads of the packaged chip; wherein the monopole radiating metal is configured to non-contact coupling with the grounding radiating metal and the electronic component when the packaged chip transmits a signal to the monopole radiating metal via the feeding circuit.