| 发明名称 |
Exposed-Heatsink Quad Flat No-Leads (QFN) Package |
| 摘要 |
Consistent with an example embodiment, there is a method for preparing an integrated circuit (IC) device having enhanced heat dissipation. The method comprises providing a heat sink array having a top-side surface and an under-side surface; the heat sink array has die placement areas on the top-side surface. A plurality of active device die are die bonded onto the die placement areas on the heat sink array. The plurality of active device die are singulated into an individual heat sink device die having a heat sink portion attached to its underside. |
| 申请公布号 |
US2016005680(A1) |
申请公布日期 |
2016.01.07 |
| 申请号 |
US201414322553 |
申请日期 |
2014.07.02 |
| 申请人 |
NXP B.V. |
发明人 |
Israel Emil Casey;van Gemert Leonardus Antonius Elisabeth;Kamphuis Tonny |
| 分类号 |
H01L23/495;H01L21/82;H01L21/52 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for preparing an integrated circuit (IC) device having enhanced heat dissipation, the method comprising:
providing a heat sink array having a top-side surface and an under-side surface, the heat sink array having die placement areas on the top-side surface; die bonding a plurality of active device die onto the die placement areas on the heat sink array; singulating the plurality of active device die into an individual heat sink device die having a heat sink portion attached to its underside. |
| 地址 |
Eindhoven NL |
