| 发明名称 |
SYSTEM FOR MANUFACTURING A SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
Provided are a system and method for manufacturing a semiconductor package. The system includes: a laser marker configured to irradiate a first laser beam on a strip to make a mark on the strip; and a laser saw configured to irradiate a second laser beam on the strip to cut the strip into individual semiconductor packages. |
| 申请公布号 |
US2016005654(A1) |
申请公布日期 |
2016.01.07 |
| 申请号 |
US201514636977 |
申请日期 |
2015.03.03 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SONG Yoon-Seok;KO Jun-Young;LEE Hae-Gu |
| 分类号 |
H01L21/78;B23K26/08;H01L21/67;B23K26/38;H01L21/268;B23K26/00;B23K26/14 |
主分类号 |
H01L21/78 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A system for manufacturing a semiconductor package, the system comprising:
a laser marker configured to irradiate a first laser beam on a strip to make a mark on the strip; and a laser saw configured to irradiate a second laser beam on the strip to cut the strip into individual semiconductor packages. |
| 地址 |
Suwon-si KR |
