发明名称 WORKPIECE PROCESSING METHOD
摘要 Disclosed is a method of processing a workpiece so as to form an opening that extends from an oxide region to a base layer through a portion between the raised regions. The method includes: (1) a step of forming an opening in the oxide region to expose a second section between the raised regions; and (2) a step of etching a residue made of silicon oxide and existing within the opening and a second section. In the second step, a denatured region is formed by exposing the workpiece to plasma of a mixed gas including a hydrogen-containing gas and NF3 gas to denature the residue and the second section, and the denatured region is removed.
申请公布号 US2016005651(A1) 申请公布日期 2016.01.07
申请号 US201514754424 申请日期 2015.06.29
申请人 TOKYO ELECTRON LIMITED 发明人 WATANABE Hikaru;HONDA Masanobu;TSUJI Akihiro
分类号 H01L21/768 主分类号 H01L21/768
代理机构 代理人
主权项 1. A method for processing a workpiece that includes a base layer, two raised regions provided on the base layer to be spaced apart from each other, a nitride region made of silicon nitride and including first sections covering the raised regions and a second section covering the base layer between the raised regions, and an oxide region made of silicon oxide and covering the nitride region, so as to form an opening that extends to the base layer through a portion between the raised regions, the method comprising: forming an opening in the oxide region to expose the second section between the raised regions; and etching a residue made of silicon oxide and existing within the opening and the second section, in which a denatured region is formed by exposing the workpiece to plasma of a mixed gas including a hydrogen-containing gas and NF3 gas to denature the residue and the second section, and the denatured region is removed.
地址 Tokyo JP
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