发明名称 Modul mit wenigstens zwei Halbleiterchips
摘要 <p>The invention relates to a module (1) having at least two semiconductor chips (4) for producing light, having a support (3), wherein the support has at least two support elements (2) arranged next to one another, wherein the support elements are connected to one another flexibly by means of a mechanical connection (5), wherein a semiconductor chip is arranged on each support element, and wherein an interconnect (7) is provided that is electrically connected to the two semiconductor chips, wherein the interconnect extends via the two support elements.</p>
申请公布号 DE112014001934(A5) 申请公布日期 2016.01.07
申请号 DE20141101934T 申请日期 2014.03.28
申请人 OSRAM OPTO SEMICONDUCTORS GMBH 发明人 HERRMANN, SIEGFRIED
分类号 H01L25/075;H01L33/48 主分类号 H01L25/075
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