IMAGE CAPTURING MODULE FOR INCREASING ADHESION STRENGTH AND ASSEMBLY FLATNESS

摘要

An image capturing module includes an image sensing unit, a housing frame and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The housing frame is disposed on the carrier substrate through a surrounding adhesion structure to surround the image sensing chip. The surrounding adhesion structure includes a surrounding adhesive layer having a uniform thickness and a plurality of spherical particles having the same size. The surrounding adhesive layer is adhesively disposed between the carrier substrate and the housing frame, and each spherical particle is disposed between the carrier substrate and the housing frame and enclosed by the surrounding adhesive layer. The actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder.

主权项

1. An image capturing module, comprising:
an image sensing unit including a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate; a housing frame disposed on the carrier substrate through a surrounding adhesion structure to surround the image sensing chip, wherein the surrounding adhesion structure includes a surrounding adhesive layer having a uniform thickness and a plurality of spherical particles having the same size, the surrounding adhesive layer is adhesively disposed between the carrier substrate and the housing frame, and each spherical particle is disposed between the carrier substrate and the housing frame and enclosed by the surrounding adhesive layer; and an actuator structure disposed on the housing frame and above the image sensing chip, wherein the actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder.