Method for Producing a Paper Carrier Card with Removable Integrated Chip Module Card, and Paper Carrier Card Made of Paper with Removable Integrated Chip Module Card

摘要

A method for producing a carrier card with a removable integrated chip-module card(s), where the carrier card is in an ID-1 format and is made of a single-layer or multilayer paper, and where the individual layers have predetermined material properties, and are joined by a waterproof adhesive. The method includes
producing a single-staged or multistaged cavity,shaping the removable integrated chip-module card(s) in a mini-SIM, micro-SIM, nano-SIM and/or embedded-SIM format with notched or through-notched features and/or webs between each removable integrated chip-module card(s) and the carrier card, andadhesive bonding of an integrated chip module into the cavity.

主权项

1. A method for producing a carrier card with a detachable integrated chip-module card, comprising the following steps:
providing a carrier card in an ID-1 format including a single-layer or multilayer paper, wherein the individual layers exhibit predetermined material properties, and the individual layers have been connected with a water-resistant adhesive, (a) producing a cavity having one or more stages, so that at least an outer and an inner partial cavity are formed, by (a1) first notching the carrier card along a contour of the outer partial cavity to be introduced into the carrier card; (a2) removing paper material within a first contour of the outer partial cavity to be introduced into the carrier card; (a4) removing paper material within a second contour of the inner partial cavity to be introduced into the carrier card; (b) shaping one or more detachable integrated chip-module cards in a mini-SIM, micro-SIM, nano-SIM and/or embedded-SIM format with notches or through-notches and/or ridges between each detachable integrated chip-module card and the rest of the carrier card; and (c) gluing an integrated chip module into the cavity.