| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment agent for a semiconductor substrate, which is used in cleaning and drying the substrate while preventing collapse of a pattern.SOLUTION: A surface treatment agent for a semiconductor substrate is supplied to a plurality of convex patterns formed on the semiconductor substrate, having a silicon-containing film in at least a portion of each of the convex patterns, and having hydroxyl group on a surface by cleaning and modifying the surface. The surface treatment agent contains a hydrolyzable group for reacting with the hydroxyl group, and forms a water repellent protective film having lower wettability to water than that of the silicon-containing film on a surface of the silicon-containing film. |
