HEAT-CONDUCTIVE SHEET AND SEMICONDUCTOR DEVICE

摘要

Provided is a heat-conductive sheet containing a heat-curable resin and a filler dispersed within the heat-curable resin, wherein the cured body of the heat-conductive sheet satisfies the belowmentioned (a): (a) when the thermal conductivity in the thickness direction of the cured body at 175°C is λz(175°C) and the thermal conductivity in the thickness direction of the cured body at 25°C is λz(25°C), λz(175°C)/λz(25°C) is at least 0.8.