发明名称 |
TRANSFER MOLDING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a transfer molding apparatus capable of improving transfer efficiency by securely making a stamper contact with a resin plate.SOLUTION: A transfer molding apparatus includes: a bucket 80 configured to house a resin plate J and a stamper 823 having an uneven pattern (irregularity region R) one over the other; and a vacuum treatment part configured to suck the air inside the bucket 80. The transfer molding apparatus presses the stamper 823 to the resin plate J to transfer-mold the uneven pattern on the resin plate J. The stamper 823 includes an air clearance groove 8231 as discharge flow path formation means for forming a flow path that enables the discharge of the air existing between the resin plate J while making contact with the resin plate. |
申请公布号 |
JP2016000455(A) |
申请公布日期 |
2016.01.07 |
申请号 |
JP20120219814 |
申请日期 |
2012.10.01 |
申请人 |
IDEMITSU UNITECH CO LTD |
发明人 |
NANBA YOSHINORI;TACHI SEIYA |
分类号 |
B29C59/02;B29C43/02;G11B5/84;G11B7/26 |
主分类号 |
B29C59/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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