| 发明名称 |
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A package structure and a method of manufacturing the package structure are disclosed. The package structure in accordance with an aspect of the present invention includes: a stiffener substrate; a dielectric layer and a circuit pattern layer laminated on the stiffener substrate; a protective layer laminated on the dielectric layer so as to protect the circuit pattern layer; a first electrode post protruded by penetrating the protective layer from the circuit pattern layer; and a chip receiving portion formed on a surface of the protective layer that is in a protruded direction of the first electrode post. |
| 申请公布号 |
US2016007467(A1) |
申请公布日期 |
2016.01.07 |
| 申请号 |
US201514790994 |
申请日期 |
2015.07.02 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
LEE Seung-Eun;KANG Myung-Sam;HWANG Jun-Oh;KOOK Seung-Yeop;SUNG Ki-Jung;LEE Young-Kwan |
| 分类号 |
H05K1/18;H05K1/11;H05K1/02;H05K3/28;H05K3/30 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package structure comprising:
a stiffener substrate; a dielectric layer and a circuit pattern layer laminated on the stiffener substrate; a protective layer laminated on the dielectric layer so as to protect the circuit pattern layer; a first electrode post protruded by penetrating the protective layer from the circuit pattern layer; and a chip receiving portion formed on a surface of the protective layer that is in a protruded direction of the first electrode post. |
| 地址 |
Suwon-Si KR |
